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    •  Bump Structure

      •  1P1M, Pillar on Pad w/ PI

      •  2P2M, Pillar on RDL w/ PI

    •  Process Capabilities

      •  Bumping packaging service (8”and 12”)

      •  Dielectric material: PI/PBO

      •  UBM: Ti/Cu/Ni sputtering target, Cu/Ni plating

      •  RDL Line/Space: min. 10um/10um

      •  Cu Pillar Pitch: min. 85um

      •  Sn-Ag Bump Pitch: min. 150um

      •  Bump Material:Sn-Ag or Cu Pillar + Sn Cap


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