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    晶圓級扇入封裝

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    • WLCSP Structure

      • 1M,Ball on Pad

      • 1P1M,Ball on Pad w/ PI

      • 2P1M,Ball on RDL w/o UBM

      • 2P2M,Ball on RDL w/ UBM

    • Process Capabilities

      • WLCSP (8”and 12”)

      • Max. Die Size: 6x6mm

      • Wafer Thickness: 12”, Min.300μm

      • Dielectric Material: PI/PBO

      • UBM:  Ti/Cu/Ni, Plated Cu

      • RDL Line/Space: min. 10um/10um

      • WLCSP Ball Pitch: 0.40mm or 0.50mm


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