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    封裝設計

    Design & Simulation Capability

    Item

    Package   Design

    Electrical   Simulation

    Thermal   Management

    Mechanical   Analysis

    1

    FC/WB BGA Design

    Impedance matching and   control

    Thermal design and   verification

    Process simulation (Molding, Reflow,   etc.)

    2

    MCM /SiP Design

    Lumped parameter   elements extraction

    Thermo-electrical   co-simulation

    Thermo-mechanical simulation (TC, HTS)

    3

    WLCSP / Fan out WLP design

    S parameters   extraction

    Hot spot effect   evaluation

    Humidity simulation

    4

    PoP/PiP design

    TDR analysis

    Thermal resistance   extraction

    Hygro-mechanical simulation

    5

    FPC design

    SI/PI analysis

     -

    Thermo-mechanical-moisture simulation (HAST, 85°C/85RH, etc.)

    6

    2.5D Interposer Design

    EMI analysis

     -

    Drop test

    7

    Ceramic Design

    IPD simulation

     -

     -

    8

    IPD Design

    RF/MW System   simulation

     -

     -  


    高密度SiP設計方案


    研究領域:

    高密度SiP封裝, 最高引腳數1W+;

    高頻器件, 封裝支持最高頻率100GHz以上;  

    先進封裝, Fanout, 2.5 Interposer,C2C鍵合、W2W鍵合 、硅基3D封裝;


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    FC+WB SiP樣品高功率SiP樣品
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    硅基3D封裝CIS封裝Fan-out封裝


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