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    Our history 公司歷史

    As an innovation model, National Center for Advanced Packaging Co., Ltd. (NCAP China) was registered in Wuxi New District, China, in September 2012. It is established by ten investors, including the leaders of the IC packaging and testing industry in China (Jiangsu Changjiang Electronics Technology, TongFu Microelectronics, Huatian Technology, Shennan Circuit Company, China Wafer Level CSP, AKM Electronic Technology (Suzhou), Jiangsu CAS Internet-of-things Technology Venture Capital, Shenzhen Fastprint Circuit Tech) and CDB Capital.

    華進半導體封裝先導技術研發中心有限公司于2012年9月在無錫新區正式注冊成立。公司英文全稱為:National Center for Advanced Packaging Co., Ltd. (NCAP China) 。公司是由中科院微電子所和集成電路封測產業龍頭企業長電科技、通富微電、華天科技、深南電路、蘇州晶方、安捷利(蘇州)、中科物聯、興森快捷九家單位以及國開基金共同投資而建立。


    Our focus 公司業務

    As a national center for advanced packaging, testing and system integration, NCAP aggressively pursues research and development through close collaboration with industry, colleges and institutes, in order to offer total solutions for the semiconductor industry. NCAP’s current research directions include: 2.5D/3D TSV and integration technologies (including TSV, bumping, via-reveal and chip-stacking), high density wafer level packaging, SiP product application and development, and verification and development of related advanced materials and equipment for microelectronics packaging.

     公司作為國家封測/系統集成先導技術研發中心,通過以企業為主體的產學研用結合新模式,開展系統級封裝/集成先導技術研究,研究領域包括2.5D/3D 硅通孔(TSV)互連及集成關鍵技術、晶圓級高密度封裝技術、SiP產品應用以及與封裝技術相關的材料和設備的驗證、改進與研發,為產業界提供系統解決方案。

     

    Our core values 公司理念

    Collaboration, Innovation, Perseverance, and Excellence

     

    Vision & Mission 愿景使命

    Vision 愿景

    World Class R&D and Commercialization Center for Advanced Packaging & System Integration國際一流的封裝與系統集成先導技術研發與產業化中心

    Mission 使命

    Innovate – Global Technology Leader in Microelectronics Packaging

    創新 – 引領微電子封裝與系統集成技術發展

    Incubate – Commercialization Center for Microelectronics Packaging Technologies in China

    應用 – 規模化成套技術轉讓能力

    Influence – Leader and active participant in global collaboration

    影響 – 推動國內外產學研用合作
    Impact - Enabler of Eco-System for Microelectronics Packaging Industry in China

    帶動 – 推進微電子封裝產業全方位生態體系


      在今后幾年中,公司將針對未來半導體封測先導技術進行研究和開發,立足于我國集成電路和電子制造產業特色,在主流技術和產業發展上趕上和部分超越國外先進水平。并通過多種方式,形成可持續發展能力和規模化成套技術轉讓能力,持續支撐國內封測產業技術升級。結合上下游產業鏈的需求,建設成為行業共性技術研發平臺、產業孵化和人才培養基地。


      公司正在招才引智,組建經營和研發團隊,現誠邀您的加入!

     


    Contact us 聯系我們

    Tel  電話:86-510-66678650

    Fax 傳真:86-510-66678653

    Email 郵箱:zhaopin@ncap-cn.com

    Add 地址:Building D1, China Sensor Network International Innovation Park, 200 Linghu Boulevard, Wuxi City, Jiangsu Province, China

    江蘇無錫新吳區菱湖大道200號中國傳感網國際創新園D1棟


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